HeatsinksDevice Mount Heatsinks
Description | Downloads | Specs | Ordering | ||
---|---|---|---|---|---|
Mini PLCC Chip Adhesive Backed Heatsink - ...H0600 |
| Adhesive backed. Ideal for providing additional cooling to PLCC chips. 10 x 10 x 10mm. | |||
Mini BGA Chip Adhesive Backed Heatsink - 2...H0604 |
| Adhesive backed. Ideal for providing additional cooling to BGA chips. 22 x 22 x 10mm. | |||
Red Heatsink Set for Raspberry PiH0607 |
| A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards. | |||
Raspberry Pi Heatsink 40W x 30L x 5HmmH0608 |
| Just peel and stick to cool your Pi 4 chips with a single heatsink. Just 5mm tall so it doesn’t interfere with HATs. | |||
Micro U TO220 HeatsinkH0630 ROHS |
| To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 28C/W. Dimensions: 19W x 19L x 9.5H | |||
Raspberry Pi Black Heatsink SetH0605 |
|
| A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards. | ||
Mini U TO220 HeatsinkH0635 ROHS |
| To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 19C/W. Dimensions: 25W x 30H x 13D | |||
Clip On TO220 HeatsinkH0639 ROHS |
| A=28 B=12.8 L=37 L = Overall length Thermal Res: 15 deg. C/W | |||
Mini PLCC Chip Adhesive Backed Heatsink - ...H0603A |
| Adhesive backed. Ideal for providing additional cooling to PLCC chips. 14 x 14 x 11mm | |||
TO3 Universal U HeatsinkH0620 ROHS |
| Use with flat pack or TO-3 package. Thermal resistance:6 deg. C/W. Dimensions: 32W x 61L x 30H | |||
TO3 Mini HeatsinkH0610 ROHS |
| Thermal resistance: 5 deg C/W Dimensions: 50W x 50L x 25H | |||
Mini U HeatsinkH0625 ROHS |
| Suits flat packs semis. Thermal resistance: 1 deg C/W. Dimensions: 28W x 25L x 34H |
All prices include GST